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Introducing new single-sensor Visible + SWIR area scan camera model

Written by JAI | June 18, 2026

JAI has expanded its Wave camera portfolio with the introduction of the Wave WAA-1300-GE-TEC, a new area scan camera that combines visible and short-wave infrared (SWIR) imaging capabilities in a single solution.

Built around an advanced InGaAs image sensor with spectral sensitivity ranging from 400 nm to approximately 1700 nm, the camera combines sensitivity to both visible and SWIR wavelengths in a single sensor.This enables the detection of material characteristics and features that may not be visible using conventional imaging technologies, while reducing the complexity associated with multi-camera solutions.



 

 

WAA-1300-GE-TEC – Visible + SWIR:

1.3-megapixel resolution
Spectral response from 400–1700 nm
Up to 90 frames per second
5 μm square pixels
GigE Vision interface
C-mount lens mount
ThermoElectric Cooling (TEC)

 




 Extending Inspection Beyond Visible Imaging 

The Wave WAA-1300-GE-TEC features a 1280 × 1024 InGaAs sensor with sensitivity from 400 nm to 1700 nm and frame rates of up to 90 fps. High quantum efficiency from 400 nm to 1700 nm enables enhanced material contrast and improved visibility of features that may be difficult or impossible to detect using visible-light cameras alone.

This expanded imaging capability supports more reliable defect detection, material classification, and quality inspection across a wide range of machine vision applications. Because both visible and SWIR information are captured by a single sensor, system integration is simplified and the need for multiple cameras, image registration, and additional processing steps can be reduced.

ThermoElectric Cooling for Stable Performance

The Wave WAA-1300-GE-TEC incorporates integrated ThermoElectric Cooling (TEC) to actively regulate sensor temperature and maintain consistent imaging performance.

By reducing sensor temperature, TEC lowers dark noise and improves image quality and dynamic range. At the same time, maintaining a stable operating temperature helps preserve calibration accuracy and image consistency under changing environmental conditions. This is particularly important in SWIR imaging applications, where sensor performance can be highly sensitive to temperature variations.

To maximize cooling efficiency, the camera also includes an integrated fan for improved heat dissipation, ensuring reliable operation. 

Designed for a wide range of applications

The camera's broad spectral sensitivity makes it suitable for numerous industrial inspection, measurement, and sorting applications.

 

Fruit and vegetable sorting and grading
Visible and SWIR image data can be used to identify bruising, moisture variations, ripeness levels, early spoilage, and subtle material differences that may not be visible to the human eye. The technology also supports grading based on size and surface quality, as well as inspection of packaged food products.



 

Semiconductor alignment
SWIR imaging can reveal alignment points hidden beneath silicon layers, enabling precise alignment of successive process layers without altering the wafer structure. The cooled sensor provides the sensitivity required for reliable detection and high-accuracy measurements.

 

Recycling
The extended spectral range supports reliable identification and classification of plastics, paper, textiles, and composite materials. By distinguishing materials based on their spectral characteristics rather than appearance alone, sorting accuracy can be improved and recovery of valuable recyclable materials enhanced.


 

Laser Beam Profiling
The camera's sensitivity across both visible and SWIR wavelengths enables accurate profiling of laser beams used in measurement and manufacturing systems. Applications include beam alignment, dimensional measurement, surface inspection, and 3D reconstruction.

 

Plastic seal inspection
Enhanced contrast between packaging materials and their contents supports reliable inspection of seals, closures, and overall package integrity. Defects such as incomplete seals, contamination, and trapped foreign materials can be identified more effectively than with visible imaging alone.

 

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