JAI is pleased to announce the release of two new high-speed CMOS line scan cameras in its Sweep Series: the SW-16000TL-CXP4A trilinear color model and the SW-16000M-CXP4A monochrome model.
JAI's new camera models offer 16K resolution with large 5 μm square pixels, coupled with a CoaXPress 4 x CXP-12 interface delivering high data throughput. This combination of high resolution and high-speed connectivity makes these cameras ideal for manufacturing processes that require detailed vision inspection of small features at high speeds.
Typical applications:
Typical applications include battery inspection, flat panel display inspection, printed circuit board (PCB) inspection, and other high-speed continuous web and print applications. This new generation of line scan cameras provides scan rate of 100 kHz (color model) and 277 kHz (monochrome model), making them significantly faster than the earlier generation of 16K line scan cameras with only 3.5 μm pixels.
Specification highlights:
|
SW-16000TL-CXP4A - Trilinear Model: ✔ 16K resolution (3 x 16384 pixels in RGB lines).
✔ Large 5 μm x 5 μm pixels for increased light sensitivity. ✔ Horizontal 2x1 binning (to 10 μm x 5 μm). ✔ 100 kHz scan rate with 4 x CXP-12. ✔ Versatile GPIO options. ✔ Direct connection to rotary encoders. ✔ Resume Scanning (backwards counter). ✔ Tilted View Correction. ✔ Intelligent Sub-Pixel Spatial Compensation. |
|
SW-16000M-CXP4A - Monochrome Model: ✔ 16K resolution (1 x 16384 pixels in a line). ✔ Horizontal 2x1 binning (to 10 μm x 5 μm). ✔ 277 kHz scan rate with 4 x CXP-12. ✔ Versatile GPIO options. ✔ Direct connection to rotary encoders. ✔ Resume Scanning (backwards counter). |
Large 5 μm square pixels and pixel binning for increased sensitivity:
Equipped with large 5 μm x 5 μm pixels, the new Sweep cameras offer enhanced light sensitivity compared to other 16K line scan cameras on the market with smaller 3.5 μm x 3.5 μm pixels. Larger pixels improve the dynamic range as well as the image quality via a better signal-to-noise ratio. Further it allows for faster inspection speeds with the same amount of light, or cost reductions by using lower intensity lighting with reduced power consumption. The pixel size can be increased with 2x1 horizontal binning (to a pixel size of 10 μm x 5 μm) giving even higher light sensitivity.
Fast data throughput via CoaXPress 2.0 interface:
The CoaXPress v2.0 interface supports CXP-6 and CXP-12 configuration, providing data throughput up to 12.5 Gbps per line (for a total of 50 Gbps using all four lines). This high throughput is critical for applications requiring high resolution and fast scan speeds. The CoaXPress interface also offers robust features such as triggering, cable lengths up to 25 meters, and the ability to connect multiple cameras to a single PC frame grabber. Its low latency and jitter ensure stable, reliable performance for high-speed industrial inspections.
Versatile GPIO options and direct connection to rotary encoders:
The cameras provide versatile GPIO and trigger options for flexible synchronization with e.g. lighting and rotary encoders supporting advanced functions like “Resume Scanning” and “Image Output Delay based on trigger counts”
Resume Scanning Function:
If the object halts unexpectedly during image acquisition, encoder triggers are counted as the object reverses direction. Once the object returns to its previous position, the camera automatically resumes capturing images from where it left off. This algorithm can help avoid lost image lines during acquisition.
Image Output Delay based on Trigger Counts:
Allows vision system designers to set "Image Output Delays" based on specific trigger encoder counts rather than fixed timing. This feature can ensure proper synchronization in conveyor belt systems where the trigger and camera may not be in the same position on a manufacturing conveyor belt or in situations where the speed of the conveyor varies, the real-time delay dynamically adjusts, allowing the camera to capture images at the optimal moment.
Intelligent Sub-Pixel Spatial Compensation. (Color model only):
The SW-16000TL-CXP4A color model features advanced algorithms for intelligent sub-pixel spatial compensation, aligning the accuracy of the three R-G-B lines. This ensures perfect image quality and improves the detection of small object defects in high-speed applications. The compensation corrects any misalignment (HALO) due to the small physical separation between the sensor lines.
Additional features:
Additional features include tilted view correction, Region-of-Interest, individual RGB gain and exposure control, an edge enhancement function for improved line and edge contrast, color space conversion and image processing capabilities like pixel sensitivity correction (PRNU/DSNU), black level adjustment, white balancing, shading correction, and chromatic aberration correction.
The camera is provided with M-95 lens mount and is delivered with a heat sink for effective dissipation of heat.
Application Examples:
| Battery inspection Ensuring flawless batteries is essential for safety, preserving energy density, and preventing premature degradation. The 16K line scan camera can be used for detecting defects on electrode sheets, including scratches, dents, craters, inclusions, bubbles, and holes. |
|
| PCB inspection The Sweep SW-16000TL camera is perfect for automated optical inspection in various stages of PCB manufacturing, including bare board inspection, gold finger checks, semiconductor inspection, and printed circuit board assembly (PCBA) inspection. |
|
|
|
Flat panel display inspection Ideal for surface inspection of flat panels and displays, JAI´s 16K camera checks color accuracy and detects defects such as dead pixels, scratches, and other imperfections. |
|
Print and web inspection |
|
Glass inspection In flat glass manufacturing, visual inspections play a crucial role in ensuring product quality and minimizing defects. Key inspection processes include surface defect detection, contamination and foreign particle identification, edge quality checks, and more |
|
|
Semiconductor inspection The cameras can be used for detecting defects on bare wafers, such as micro cracks and scratches, along with inspecting patterned wafers for pattern defects and photomask alignment, as well as quality and defect inspections on mounted chip circuits within semiconductor packages. |