JAI returned to VISION Stuttgart this October, showcasing our latest industrial imaging technologies through 11 live demonstrations and a broad display of area scan and line scan cameras.
From multispectral RGB+NIR and prism-based color imaging to SWIR, UV, high-resolution imaging, and technology previews, visitors had the opportunity to experience JAI’s latest camera technologies in action and discuss their applications directly with our team.
Industrial Vision Days: How Multispectral Vision Transforms Food Inspection
James Cameron, Global Segment Director, Food at JAI, took part in this year’s Industrial Vision Days with his presentation, “How Multispectral Vision Transforms Food Inspection.”
The presentation explored the growing role of multispectral imaging in food inspection and how combining information from different spectral bands can help vision systems address increasingly demanding inspection and sorting tasks.
One of the technologies demonstrated at our booth was the new SW-8000Q-CXP2A from JAI’s Sweep+ Series.
The camera uses JAI’s prism technology to simultaneously capture red, green, blue, and Near Infrared (NIR) information. By combining visible color and NIR information in a single scan, the camera enables inspection systems to analyze both color and material characteristics simultaneously.
Key Applications: Battery inspection, plastic and material sorting, security printing, food inspection, web inspection, pharmaceutical inspection and semiconductor inspection.
Visitors could also see the difference between JAI’s three-sensor prism technology and conventional single-sensor Bayer color imaging.
The live demonstration compared the Apex Series AP-5100T-5GE with the Go-X Series GOX-5105C-PGE, highlighting the advantages of prism-based imaging in areas such as color reproduction, spatial resolution, and waveband separation.
Key Applications: Semiconductor inspection, display inspection, pharmaceutical inspection, print inspection and applications requiring high color accuracy or inspection of very fine structures.
The Fusion Series FS-3200T-10GE-NNC demonstrated another approach to multispectral inspection, combining RGB and NIR imaging within a single area scan camera.
Its prism-based architecture provides pixel-perfect multispectral data across up to five spectral bands, supporting applications where information from multiple wavelengths needs to be accurately compared.
Key Applications: Crop management, smart agriculture, environmental research, surgical assistance, life sciences, sorting of fruits, vegetables, nuts.
JAI also demonstrated the GO-8105M-5GE-UV from the Go Series, extending machine vision inspection into the ultraviolet spectrum.
UV imaging opens additional possibilities in applications such as electronics and semiconductor inspection, pharmaceutical and medical inspection, and print inspection, where features that may be difficult to detect using conventional visible imaging can become accessible.
Key Applications: Arc monitoring, high-precision surface scratch detection, material sorting, criminal investigation, scientific research, and transparent resin coating inspection, etc.
SWIR technology also played an important role at this year’s JAI booth.
The Wave Series WAA-1300-GE-TEC combines Sony’s IMX990 sensor with integrated thermoelectric cooling (TEC), providing imaging across the 400–1700 nm spectral range with stable, low-noise performance.
This enables a single camera to capture information across both the visible and SWIR spectrum for inspection applications that require more than conventional visible imaging.
Key Applications: Wafer IR inspection, wafer micro-crack detection, wafer bonding inspection, wafer dicing blade positioning, ABF substrate drilling inspection, hyperspectral imaging, fruit and vegetable color sorting, pharmaceutical vial light inspection, scientific research.
Visitors also had the opportunity to preview the new Wave Series WAL-2001-GE, featuring JAI’s latest 2K pixel-shift technology for high-quality SWIR line scan imaging.
The demonstration provided a look at JAI’s continued expansion of the Wave Series and our development of new SWIR solutions for industrial inspection.
Key Applications: PV PL inspection, PV micro-crack detection, semiconductor wafer micro-crack detection, semiconductor wafer bonding bubble inspection, color sorting, hyperspectral imaging, scientific research.
For demanding applications requiring both high resolution and speed, the Sweep Series SW-16000TL-CXP4A demonstrated high-resolution RGB line scan imaging.
Key Applications: Semiconductor inspection, PCB inspection, print inspection, web inspection, electronics inspection and other applications requiring very high spatial resolution combined with accurate color reproduction.
JAI’s Spark Series was also part of the live demonstrations, offering visitors an exclusive preview of an upcoming camera featuring CoaXPress over Fiber technology.
The new camera combines high-resolution, high-speed area scan imaging with the bandwidth required for demanding applications, while supporting long cable distances. This gives system designers additional flexibility when building large or complex machine vision systems.
Key Applications: Semiconductor inspection, PCB inspection, electronics inspection, 3C inspection, large-area high-resolution measurement and other applications requiring extremely high image data rates.
VISION is not only an opportunity to showcase what is available today, but also to give visitors a look at what we are working on for the future.
At this year’s booth, JAI presented number of technology previews currently under development, giving visitors an early look at technologies that will further expand our product portfolio.
The JAI team would like to thank everyone who visited our booth at VISION Stuttgart 2026. It was a pleasure meeting customers, partners, system integrators, and other members of the machine vision community and sharing our latest technologies with you.
Couldn’t make it to VISION Stuttgart this year?
Explore JAI’s camera portfolio and get in touch with our team to learn more about any of the technologies demonstrated at the show.